Six-axis Pressing Machine
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Used for LEDwafers in fittings in the semiconductor industry and is applicable for 2- to 8-inch wafer surface materials like Au/Au, Au/In, and Au/Te, as well as oxide andcommon films.
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Category |
Used for LEDwafers in fittings in the semiconductor industry and is applicable for 2- to 8-inch wafer surface materials like Au/Au, Au/In, and Au/Te, as well as oxide andcommon films. |